Our Solutions

Thermal Management Solutions

Material / Product Types

  • Thermal Gap Pads
  • Thermal Gap Fillers
  • Thermal Insulators
  • Thermal Phase Change
  • Thermally Conductive Tapes
  • Thermal Conductive Pastes
  • Thermal Conductive Gels


  • Low-modulus polymer material
  • Innovative filler technology to achieve specific thermal and conformability characteristics
  • Highly conformable to uneven and rough surfaces with very low-stress thermal gap pad compression
  • Electrically isolating
  • Variety of thickness and hardness
  • Range of thermal conductivities
  • Manufactured to customer size requirements


Proven Knowledge

Deep engineering capabilities with expert knowledge of EMI RFI specifications

Field Proven

1,000’s of designs integrated into battle-harsh and commercially challenging environments

Proven Track Record 

Orders delivered on time and to specification


Manufacturing Capabilities

From initial production design to full scale production

Continuous Improvement

Driven to maintain a zero-return rate


From project concept until completion

Thermal Gap Pads provide effective thermal interfaces between heat sinks and electronic devices, with accommodation for uneven surfaces, air gaps and rough textures. The thermally conductive pads’ soft construction offers high conformability to reduce interface resistance. In addition to effective heat dissipation, thermal Gap Pads help reduce vibration stress for shock dampening.

Gap Pads are produced in a variety of hardness and thicknesses, and are fabricated to customers’ dimensional requirements. Thermal Gap Pad materials are always designed to your specific application to ensure optimized thermal control.

Our Process

Our Material