Our Solutions
Thermal Management Solutions
Thermal Gap Pads provide effective thermal interfaces between heat sinks and electronic devices, with accommodation for uneven surfaces, air gaps and rough textures. The thermally conductive pads’ soft construction offers high conformability to reduce interface resistance. In addition to effective heat dissipation, thermal Gap Pads help reduce vibration stress for shock dampening. Gap Pads are produced in a variety of hardness and thicknesses, and are fabricated to customers’ dimensional requirements. Thermal Gap Pad materials are always designed to your specific application to ensure optimized thermal control.
Material / Product Types
- Thermal Gap Pads
- Thermal Gap Fillers
- Thermal Insulators
- Thermal Phase Change
- Thermally Conductive Tapes
- Thermal Conductive Pastes
- Thermal Conductive Gels
Applications
- Low-modulus polymer material
- Innovative filler technology to achieve specific thermal and conformability characteristics
- Highly conformable to uneven and rough surfaces with very low-stress thermal gap pad compression
- Electrically isolating
- Variety of thickness and hardness
- Range of thermal conductivities
- Manufactured to customer size requirements
Proficiencies
Proven Knowledge
Deep engineering capabilities with expert knowledge of EMI RFI specifications
Field Proven
1,000’s of designs integrated into battle-harsh and commercially challenging environments
Proven Track Record
Orders delivered on time and to specification
Performance
From initial production design to full scale production
Continuous Improvement
Driven to maintain a zero-return rate
Collaborating
From project concept until completion
Thermal interfaces that move
heat off the part.
Thermal gap pads create an effective interface between heat sinks and electronic devices — accommodating uneven surfaces, air gaps, and rough textures. Their soft, highly conformable construction lowers interface resistance while dampening vibration and shock. Every pad is die-cut to your dimensions and engineered to your application to ensure optimized thermal control.
ISO 9001:2015 · ITAR Registered · RoHS · UL 94 · Made in USA
Thermal conductivity
on top gap-pad grades
Interface material
families converted
Service range across
silicone grades
Quote turnaround
no minimum order
Engineered
thermal stack
Gap pad · PCM · TIM
0.6 – 15 W/m·K
0.020″ – 0.400″
±0.005″ std · ±0.002″ tight
24-hour quote · no minimum
Bridge the gap,
move the heat.
A thermal interface material fills the microscopic and macroscopic gaps between a heat-generating component and its heat sink. Replacing trapped air with a conformable, conductive pad is what turns a rough mechanical contact into an efficient thermal path.
Air is a thermal insulator — the gaps between a component and its heat sink are where heat gets trapped.
Thermal gap pads replace that air with a soft, thermally conductive elastomer that conforms to uneven surfaces and rough textures, lowering interface resistance so heat flows from the device into the sink, spreader, or chassis.
Beyond heat dissipation, the pad’s compliant construction adds vibration and shock dampening across the joint. Grades span a wide conductivity, hardness, and thickness range — always specified to your application for optimized thermal control.
01
Conform to uneven surfaces
Soft, low-modulus construction flows into surface roughness, air gaps, and component height variation — displacing insulating air with a continuous conductive path.
02
Dissipate heat efficiently
High through-plane conductivity carries heat from the die or component into the heat sink, spreader, or chassis, holding junction temperatures inside their operating window.
03
Dampen vibration & shock
The same compliant elastomer absorbs mechanical stress across the joint, protecting solder joints and delicate assemblies in rugged and mobile service.
04
Fabricated to your dimensions
Die-free Zünd conversion cuts pads, kiss-cut kits, and custom stack-ups to exact print geometry — prototype through production, no tooling cost.
The right interface
for the joint.
Gap size, clamping pressure, and assembly method decide the interface material. We stock and convert the full TIM family across the leading manufacturers — matched to your thermal budget and mechanical constraints.
Soft silicone elastomerSheet · die-cut1–15 W/m·KFills air gaps between components and heat sinks; conforms to uneven surfaces and stack height variation.
PCM · pre-applied filmFilm · pad3–8 W/m·KSoftens at operating temperature for a minimal bond line — the low-resistance performance of grease without the mess.
Double-sided PSATape · kiss-cut0.6–2 W/m·KBonds heat sinks and spreaders without mechanical fasteners where clamping pressure is unavailable.
Formable / dispensablePutty · pad1–6 W/m·KConforms to complex 3D geometry and large, variable stack heights with very low assembly stress.
Ceramic-filled siliconeSheet · die-cut1–3 W/m·KCombines electrical isolation with heat transfer for TO-package power devices and busbars.
Flexible graphite sheetFilm · laminate400+ in-planeSpreads heat laterally in thin, space-constrained assemblies where a heat sink will not fit.
Thermal conductivity values are representative of commercial TIM systems and vary with thickness, applied pressure, and bond-line quality. Send your power dissipation, gap, and pressure budget — we’ll confirm the material and construction against your assembly.
The right grade
for the heat load.
Gap pads are produced across a range of hardness, thickness, and conductivity, and fabricated to your dimensional requirements. Higher conductivity trades against softness — the correct balance is the one matched to your device.
General-Purpose Gap Pad
Soft, highly conformable, low-cost interface for modest heat loads — minimal assembly stress on delicate boards and components.
Mid-Conductivity Gap Pad
A balanced grade lifting heat transfer while staying soft and forgiving — the workhorse for most electronics cooling.
High-Conductivity Gap Pad
Elevated through-plane performance for denser heat loads, with good conformability retained for reliable contact.
Ultra-Conductivity Gap Pad
High-loaded silicone for demanding modules where junction temperature is the limiting design constraint.
Maximum-Conductivity Gap Pad
Top-tier through-plane conductivity for the highest heat-flux devices, specified where every degree of margin counts.
Electrically-Insulating Pad
Ceramic-filled construction that isolates electrically while transferring heat — for TO-package devices and busbars.
Gap pad comparison — at a glance
Values are representative and vary by manufacturer, thickness, and applied pressure. Softer, lower-conductivity grades minimize assembly stress on delicate boards; high-load grades maximize heat transfer where junction temperature governs. Send your service conditions — we’ll confirm the grade against gap, pressure, and thermal budget.
Cooling built
to spec.
Published capability across thermal interface materials. Conductivity, thickness, and dielectric performance are verified against your gap, applied pressure, and thermal budget.
Non-standard stack?
We regularly deliver
custom TIM stack-ups
and kiss-cut kits.
Send your print and thermal requirement. If we can convert it, we’ll quote it.
Where our thermal
interfaces ship.
From battle-harsh defense electronics to hyperscale data centers, PNA thermal interface materials pull heat off the part across programs where junction temperature governs reliability.
01 / 06
Defense Electronics
- Power amplifier cooling
- Radar TR module TIMs
- Ruggedized computing
- Vibration-damped interfaces
02 / 06
Aerospace & Avionics
- LRU thermal management
- Cockpit display cooling
- Power conversion units
- Low-outgassing grades
03 / 06
EV & Automotive
- Battery pack gap fillers
- Inverter & motor-control cooling
- ADAS & ECU thermal pads
- On-board charger TIMs
04 / 06
Telecom & 5G
- Base station power amplifiers
- Optical transceiver cooling
- Remote radio heads
- Switch & router modules
05 / 06
Computing & Data Center
- CPU / GPU / ASIC interfaces
- Memory & SSD cooling
- Server power stages
- Heat-spreader bonding
06 / 06
LED & Power Electronics
- LED array heat sinking
- IGBT & MOSFET modules
- Power supply cooling
- Busbar isolation pads
Specify beyond
the standard pad.
Every interface can be tailored to the program — adhesive, isolation, stack-up, regulatory grade, and kitting, called out on the same quote.
01 / 06
Adhesive backing
One- or two-side pressure-sensitive adhesive for fixturing during assembly where clamping pressure is limited.
02 / 06
Electrically insulating
Ceramic-filled and dielectric grades that isolate electrically while transferring heat across the joint.
03 / 06
Custom stack-ups
Multi-layer TIM constructions — pad, film, and carrier laminated to a single converted part.
04 / 06
Low-outgassing
NASA low-outgassing (ASTM E595) grades for space, vacuum, and sealed optical assemblies.
05 / 06
UL 94 flammability
Flame-rated grades to UL 94 V-0 for enclosures with regulatory flammability requirements.
06 / 06
Kiss-cut kitting
Kiss-cut on liner, tabbed, and kitted for fast, repeatable line placement in high-volume assembly.
Custom construction
Something else?
If your spec calls for a material or construction not listed here, send it — we’ll source and quote it.
Proficiencies
& performance.
Deep engineering capability, materials in stock, and a quality system built around defense and aerospace compliance from day one.
Field proven
Thousands of designs integrated into battle-harsh and commercially challenging environments — thermal interfaces that hold up where it counts.
Proven track record
Orders delivered on time and to specification, from prototype quantities through full-scale production runs.
Continuous improvement
Driven to maintain a zero-return rate. Every lot is inspection-closed before it leaves the floor.
Deep engineering
Expert knowledge of thermal interface selection and material tradeoffs, collaborating from concept through completion.
More from the
PNA capability set.
Thermal management is one family on a single CAD-driven production floor. Explore the rest of what we convert.
01 / 06
Conductive elastomer shielding gaskets converted to print — silver, copper, and nickel-graphite fills per MIL-DTL-83528.
02 / 06
Electrically conductive elastomer O-rings for EMI shielding in threaded and flanged enclosures.
03 / 06
Conductive elastomer flange gaskets for avionics LRU sealing, radar modules, and enclosure joints.
04 / 06
High-performance environmental gaskets converted from silicone, EPDM, Viton, and neoprene grades.
05 / 06
Dielectric components cut from Nomex, Mylar, and Kapton for battery packs and HV enclosures.
06 / 06
Tier-one stocking relationships across the leading EMI, thermal, and sealing material manufacturers.
Need custom gap
pads? Quotes in 24 hours.
Include the gap, applied pressure, power dissipation or target conductivity, quantity, and any adhesive or compliance requirement. We’ll respond within 24 business hours with feasibility, lead time, and price.
Die-cut to print · custom stack-ups · kiss-cut kitting · rapid turnaround